D. Tenciu, C.R. Iordanescu, R. Savastru, I.D. Feraru, A. Kiss, C.N. Zoita, R. Notonier, A. Tonetto, M. Eyraud, L. Tortet, 2012. Porous Al2O3 films obtained by PLD on copper templates. Digest Journal of Nanomaterials and Biostructures, 7(1), pp. 393 – 397, ISSN 1842-3582.

 Title: Porous Al2O3 films obtained by PLD on copper templates


Porous Al2O3 films were deposited on copper thin film templates onto silicon substrates by means of pulsed laser deposition (PLD) technique using a KrF excimer laser. The copper films have been first deposited in vacuum on Si substrates at room temperature, with a particular distribution of Cu droplets to favour pores formation. Alumina deposition has been done following ablation of a pure Al target at 10-3 Torr oxygen pressure at different substrate temperatures: room temperature, 600 °C and 650 °C. The characterization of samples involved micro-Raman spectroscopy, FTIR spectroscopy, scanning electron microscopy (SEM), atomic force microscopy (AFM) and energy dispersive x-ray spectroscopy (EDS) to reveal structural and morphological properties. FTIR and Raman spectroscopy results corroborated with EDS analyses confirm the presence of alumina in the Al2O3/Cu/Si structures. SEM images show ~300 nm ordered pores in films deposited at room temperature.